Encyclopedia of packaging materials, processes, and mechanics. Set 1, Interconnect and wafer bonding technology / editors, Pengli Zhu, Gang Li, C. P. Wang ; editor-in-chief Avram Bar-Cohen, Jeffrey C Suhling and Andrew A.O. Tay.

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Includes bibliographical references and index.

Title: Encyclopedia of packaging materials, processes, and mechanics. Set 1, Interconnect and wafer bonding technology / editors, Pengli Zhu, Gang Li, C. P. Wang ; editor-in-chief Avram Bar-Cohen, Jeffrey C Suhling and Andrew A.O. Tay.
Artist: Zhu, Pengli, editor.
Subjects
Language: English
Type: Book
Abstract
Year: 2019
Original Publisher(s)
Digital Publisher(s)