Multichip modules / edited by Ernest S. Kuh
Digitised Book 216.73.216.10 (0)
Information About
This collection of articles gives an indepth, state-of-the-art study of the Multichip Module (MCM) technology from systems, CAD and technology viewpoints. Multichip Module technology has been used in high-end systems, such as mainframe and supercomputers as well as military and space applications for some time. Rapid advances in VLSI technology and novel system architecture concepts have presented both challenges and opportunities for MCM technologists.
Additional Details
- Title
- Multichip modules / edited by Ernest S. Kuh
- Subject
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- Multichip modules (Microelectronics)
- Microelectronic packaging
- Electronic packaging
- Publisher
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- World Scientific,
- National Library Board Singapore,
- Contributors
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- Kuh, Ernest S.
- Digital Description
- application/pdf, ill.
- Table of Contents
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- Introduction -- Early assessment of design, packaging and technology tradeoffs -- The VAX 9000 multichip packaging and its evolution to future high end computer applications -- Si-on-Si MCM technology and its applications --Design automation for multichip module: issues and status -- Performance driven layout for thin-film multichip modules -- Transient simulation of lossy coupled transmission lines characterized with frequency-dependent parameters.
- Copyright
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- All Rights Reserved. National Library Board Singapore 2009.