High performance design automation for multi-chip modules and packages / editor, Jun-Dong Cho ; co-editor, Paul D. Franzon
Digitised Book 216.73.216.191 (0)
1996
Information About
The concept of Multi-Chip Modules (MCM) was developed for packaging high speed systems. Today's electronics industry requires new design automation tools and design methodologies that allow designers to concurrently design high performance integrated circuits and high performance packaging. The purpose of this book is to investigate recent developments in algorithm design and combinatorial structures to High Performance Design Automation of MCMs.
Additional Details
- Title
- High performance design automation for multi-chip modules and packages / editor, Jun-Dong Cho ; co-editor, Paul D. Franzon
- Subject
-
- Electronic packaging--Design--Data processing
- Multichip modules (Microelectronics)--Design--Data processing
- Computer-aided design
- Publisher
-
- World Scientific, 1996
- National Library Board Singapore, 1996
- Contributors
-
- Cho, Jun-Dong
- Franzon, Paul D.
- Digital Description
- application/pdf, ill.
- Table of Contents
-
- pt. 1. Physical design optimization for MCMs. An overview of placement and routing algorithms for multi-chip modules. Early feasibility and cost assessment for multichip module technologies... -- pt. 2. Other MCM and package design optimizations. An overview of techniques for partitioning multichip modules. Interconnect design and synthesis in high speed printed circuit boards and multi-chip modules...
- Copyright
-
- All Rights Reserved. National Library Board Singapore 2009.